Several important documents have been signed at the exhibition stand of the Moscow Government at the 5th annual Open Innovations Forum in Skolkovo. Among them are a memorandum of understanding with the Chinese company TechCode Global and 12 agreements on pilot projects with the winners of Open Innovation Marketplace (OIMP).
TechCode Global's visit to Moscow was one of the highlights of the forum. The company manages China's largest network of business incubators. During the visit, Erica Juang, the CEO of TechCode, met with Natalia Sergunina, Moscow Deputy Mayor for Economic Policy and Land-and-Property Regulations. They discussed the key areas of future collaboration highlighted in the memorandum of understanding signed at the event as well as potential joint activities in the field of innovation.
The goal of the memorandum is to encourage foreign investments into Russian projects and facilitate the exchange of technologies. The signing of the document will enable favorable conditions for the entry of Moscow-based tech startups and small enterprises to the Chinese market. On the other hand, the memorandum will contribute to an influx of investments and technologies from China and other countries of TechCode's presence. The memorandum also foresees the creation of a Moscow business incubator, which will also be a member of TechCode's global network.
Another highlight of the forum was the signing of agreements on pilot projects with 12 winners of Open Innovation Marketplace, a startup competition in industry-specific challenges that took place during the 33rd IASP World Conference.
Five Moscow government departments and three corporations will test solutions that address the city's needs in healthcare, environment management, transportation, construction, industrial internet of things, etc.
Finally, five Moscow high-school students signed deferred employment contacts with local hi-tech companies at the forum. Under the terms of their contacts, the students will be offered relevant high-paying jobs upon graduation.